Electronic and IC Packages

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC).

Turnkey Solution for Production Ready Pedestals

Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging.

Sizes

Our heat spreader materials for IC packages are offered in a wide breadth of sizes including:

• Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm)
• Down to finished machined and plated products in 0.015” (0.381mm) cubes

Hermetic Housings and Heat Sinks

These thermal management products are used as both the hermetic housings and as the expansion-matched electronic heat sink and thermal spreaders for electronics.

Tight Thermal Expansion Control for IC Packages

We have the expertise to manufacture custom thermal management products for IC packages to allow for very specific rates of expansion and customized compositions for CTE Match. The heat sink material can be matched to the CTE of specific semiconductors for the elimination of cracking due to uneven expansion at the interface of the semiconductor and the heat sink. Our processing ensures isotropic properties within the x-y plane while offering flexibility of thickness (z-direction) for the most efficient designs.