Molybdenum-Copper Composites

Our molybdenum-copper composites (AMC) combine the unique properties of molybdenum with the high thermal conductivity of copper, resulting in a powerful metal matrix composite for thermal management.

Molybdenum provides a very high melting point, low thermal expansion, and notable thermal conductivity, while copper’s exceptional heat transfer efficiency makes it ideal for dissipating heat.

Molybdenum-Copper Advantages

With a unique blend of mechanical and chemical properties, molybdenum-copper offers exceptional benefits for thermal management applications, including:

High Thermal Conductivity: Our advanced powder metallurgy composites deliver superior through-thickness thermal conductivity, outperforming competitive materials.

High Ductility: Excellent ductility allows precise machining into complex shapes without compromising strength, making AMC ideal for intricate heat dissipation components. Our composites are also readily plateable.

Excellent dimensional stability: With its excellent dimensional stability and corrosion resistance, our material ensures long product service life.

Customized Thermal Expansion: AMC materials are available in standard compositions, but we also offer custom-engineered formulations to meet specific thermal expansion requirements.

Molybdenum-Copper Applications

Due to its high thermal conductivity and low thermal expansion, molybdenum-copper (AMC) is used for a variety of semiconductor and electronic applications including:

• Electronic packages
• Chip mounting
• Heat sinks
• Circuit board cores
• Thermal spreaders

Molybdenum-Copper Packaging

We provide a range of packaging services designed to protect, secure, and preserve the quality of our products.

• Waffle pack based on custom size of part
• Reel and tape packaging for production line efficiencies
• Glass Vial or custom solution