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Heat sink materials in molybdenum, copper & tungsten composites for thermal management in I/C and electronic packaging

Thermal Management Materials

Controlling heat dissipation in hermetically sealed devices that house electronic components is a major challenge in the electronics sector. Our Molybdenum-Copper (AMC) and Tungsten-Copper (AWC) composites are engineered through wrought powder technology to deliver improved thermal conductivity and highly controlled thermal expansion. Critical applications include heat sink material, pedestals, substrates, thermal spreaders, machined components, and material blanks.
Preferred materials for GaAs and GaN Products
Due to their excellent thermal conductivity and controlled thermal expansion, our Molybdenum-Copper and Tungsten-Copper composites are the preferred materials for Gallium Arsenide (GaAs) and Gallium Nitride (GaN) semiconductors for the defense industry. Our heat spreader materials are trusted in sensitive applications such as:
  • Advanced active radars
  • Electronic countermeasures
  • Jamming equipment
Sizes
Molybdenum-Copper and Tungsten-Copper material is available as finished parts with the following maximum dimensions depending on overall size
  • Width: 4 inches (102 mm)
  • Thickness: 3 inches (76 mm)
  • Length: 24 inches (610 mm)
Our thermal management materials can be machined into shapes and readily plated and have superior through-thick-ness thermal conductivity versus other products. Furthermore, our ability to process into net shape and block form allow us to offer these materials for further machining into finished package products.
Tight Thermal Expansion Control
Heat spreader materials offer differing thermal expansion rates can be engineered to specific I/C materials. Although our Molybdenum-Copper and Tungsten-Copper materials are available in standard chemistry steps of 5%, we have the expertise to manufacture small volume custom engineered products to allow for very specific rates of expansion and customized compositions for CTE Match.
Turnkey Solution for Production Ready Pedestals
Our advanced thermal management materials are offered as raw material in sheet or block form. We also maintain the capabilities to vertically integrate for turnkey solutions customers in much the same way as our blended matrix products. We offer:
  • Custom sized pedestals via Electrical Discharge Machining (EDM)
  • High tolerance machining
  • Nadcap™ accredited plating
  • Pick & place packaging options such as waffle packs
  • Burr-free edges
Applications
Our Molybdenum-copper and tungsten-copper composites are used in electronic packaging thermal management applications. These include:
  • Chip mounting
  • Heat sink material for naval, ground-based and aerospace radar
  • Circuit board cores
  • Lids or covers
  • Heat spreader
  • Semiconductors for the defense industry
  • Electric countermeasures
  • Jamming equipment
  • Microwave Packages
  • High RF Applications
  • Laser Mounts
  • Optoelectronics
  • Nickel-Gold plated external power amplifiers
  • 5G mobile internet network
Thermal management materials are used extensively copper heat sink material & pedestals for integrated circuits (I/C) as well as the supporting cases for I/C packaging. We offer heat spreader material in cross-rolled sheet form for excellent x-y expansion properties as well as in pre-machined block form for I/C packaging.
MOLYBDENUM-COPPER COMPOSITES (AMC SERIES)
MOLYBDENUM-COPPER COMPOSITIONS
AMC 6040 60% Molybdenum-40% Copper
AMC 6535 65% Molybdenum-35% Copper
AMC 7525 75% Molybdenum-25% Copper
AMC 8020 80% Molybdenum-20% Copper
AMC 8515 85% Molybdenum-15% Copper

MOLYBDENUM-COPPER DENSITY
g/cm3 lb./in.3
AMC 6040 9.68 0.349
AMC 6535 9.74 0.352
AMC 7525 9.87 0.356
AMC 8020 9.94 0.359
AMC 8515 10.01 0.361

MOLYBDENUM-COPPER THERMAL CONDUCTIVITY
W/mK BTU/hr.ft.°F
AMC 6040 215 125
AMC 6535 205 119
AMC 7525 185 108
AMC 8020 175 102
AMC 8515 165 96

MOLYBDENUM-COPPER THERMAL EXPANSION (in./in. x10 -6/°C)
30-150° C 30-400° C 30-800° C
AMC 6040 9.5 10.2 10.5
AMC 6535 9.0 9.4 9.8
AMC 7525 7.8 8.0 8.4
AMC 8020 7.2 7.5 7.9
AMC 8515 6.8 7.0 7.4

TUNGSTEN-COPPER COMPOSITES (AWC SERIES)
TUNGSTEN-COPPER COMPOSITIONS
AWC 7525 75% Tungsten-25% Copper
AWC 8020 80% Tungsten-20% Copper
AWC 8515 85% Tungsten-15% Copper
AWC 8812 88% Tungsten-12% Copper
AWC 9010 90% Tungsten-10% Copper

TUNGSTEN-COPPER DENSITY
g/cm3 lb./in.3
AWC 7525 14.98 0.541
AWC 8020 15.68 0.567
AWC 8515 16.45 0.594
AWC 8812 16.95 0.612
AWC 9010 17.3 0.625

TUNGSTEN-COPPER THERMAL CONDUCTIVITY
W/mK BTU/hr.ft.°F
AWC 7525 186 107
AWC 8020 175 101
AWC 8515 162 93
AWC 8812 155 90
AWC 9010 150 86

TUNGSTEN-COPPER THERMAL EXPANSION (in./in. x10 -6/°C)
30-150° C 30-400° C 30-800° C
AWC 7525 9.06 9.55 9.68
AWC 8020 8.21 8.60 8.63
AWC 8515 7.36 7.65 7.58
AWC 8812 6.78 7.00 6.86
AWC 9010 6.51 6.70 6.53