Thermal management in hermetically sealed components is critical in electronic devices. Our Molybdenum-Copper (AMC) and Tungsten-Copper (AWC) materials deliver high thermal conductivity and tightly controlled thermal expansion, making them ideal for demanding applications such as heat sinks, pedestals, and thermal spreaders in advanced electronic systems.
Which Thermal Management Materials Perform Best for GaAs and GaN Devices?
Due to their excellent thermal conductivity and controlled thermal expansion, our Molybdenum-Copper and Tungsten-Copper composites are the preferred materials for Gallium Arsenide (GaAs) and Gallium Nitride (GaN) semiconductors for the defense industry. Our heat spreader materials are trusted in sensitive applications such as:
- Advanced active radars
- Electronic countermeasures
- Jamming equipment
Which Size Options Can MoCu and WCu Thermal Management Materials Be Produced In?
Molybdenum-Copper and Tungsten-Copper material is available as finished parts with the following maximum dimensions depending on overall size
- Width: 4 inches (102 mm)
- Thickness: 3 inches (76 mm)
- Length: 24 inches (610 mm)
Our thermal management materials can be machined into shapes and readily plated and have superior through-thick-ness thermal conductivity versus other products. Furthermore, our ability to process into net shape and block form allow us to offer these materials for further machining into finished package products.
Why Is Thermal Expansion Matching Critical in Semiconductor Packaging?
Heat spreader materials offer differing thermal expansion rates can be engineered to specific I/C materials. Although our Molybdenum-Copper and Tungsten-Copper materials are available in standard chemistry steps of 5%, we have the expertise to manufacture small volume custom engineered products to allow for very specific rates of expansion and customized compositions for CTE Match.
What Makes AMETEK Wallingford an End to End Supplier for Thermal Management Pedestals?
Our advanced thermal management materials are offered as raw material in sheet or block form. We also maintain the capabilities to vertically integrate for turnkey solutions customers in much the same way as our blended matrix products. We offer:
- Custom sized pedestals via Electrical Discharge Machining (EDM)
- High tolerance machining
- Nadcap™ accredited plating
- Pick & place packaging options such as waffle packs
- Burr-free edges
What Are the Primary Applications of MoCu and WCu Composites?
Our Molybdenum-copper and tungsten-copper composites are used in electronic packaging thermal management applications. These include:
- Chip mounting and IC pedestals
- Heat sinks (including radar, defense, and high-power electronics)
- Circuit board cores
- Electronic packaging lids, covers, and case materials
- Heat spreaders and thermal management components
- Microwave packages
- High RF and microwave applications
- RF and microwave amplifiers (GaAs, GaN, MMICs, aero RF)
- External power amplifiers
- 5G telecom infrastructure (cellular base stations, IGBT baseplates/power modules)
- Defense electronics (including semiconductor systems)
- Electronic warfare systems (countermeasures and jamming equipment)
- Laser mounts
- Optoelectronic devices (including LEDs and semiconductor lasers)
- Data center electronics
Thermal management materials are used extensively as copper heat sink material & pedestals for integrated circuits (I/C) as well as the supporting cases for I/C packaging. We offer heat spreader material in cross-rolled sheet form for excellent x-y expansion properties as well as in pre-machined block form for I/C packaging.
