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Thermal Management Products for the electronics industry

Thermal Management Materials

We develop Molybdenum-Copper (AMC) and Tungsten-Copper (AWC) composites through wrought powder technology with unique properties for the electronics industry including: heat sinks, substrates, thermal spreaders, machined components, and material blanks.

Due to their excellent thermal conductivity and controlled thermal expansion, our Molybdenum-Copper and Tungsten-Copper composites are the preferred materials for Gallium Arsenide (GaAs) and Gallium Nitride (GaN) semiconductors for the defense industry. Our products are trusted in sensitive applications such as advanced active radars, electronic countermeasures, and jamming equipment.

All of our thermal management products are offered as raw material in sheet or block form but we also maintain the capabilities to vertically integrate for turnkey solutions. These include sized pedestals via Electrical Discharge Machining (EDM), high tolerance machining, plating and packaging options such as waffle packs.

Specifications
Molybdenum-Copper and Tungsten-Copper material is available as finished parts with the following maximum dimensions depending on overall size

  • Width: 4 inches (102 mm)
  • Thickness: 3 inches (76 mm)
  • Length: 24 inches (610 mm)

Our wrought powder metallurgy composites products can be machined into shapes and readily plated and have superior through-thick-ness thermal conductivity versus other products. Furthermore, our ability to process into net shape and block form allow us to offer these materials for further machining into finished package products.

Tight Thermal Expansion Control
These materials offer differing thermal expansion rates that can be engineered to specific I/C materials. Although our our Molybdenum-Copper and Tungsten-Copper materials are available in standard chemistry steps of 5%, we have the expertise to manufacture small volume custom engineered products to allow for very specific rates of expansion and customized compositions for CTE Match.

Applications
Our Molybdenum-copper and tungsten-copper composites are uniquely suited to many applications in electronic devices. 

  • Chip mounting
  • Heat sinks for naval, ground-based and aerospace radar
  • Circuit board cores
  • Lids or covers
  • Thermal spreaders
  • Semiconductors for the defense industry
  • Electric countermeasures
  • Jamming equipment
  • Microwave Packages
  • High RF Applications
  • Laser Mounts
  • Optoelectronics
  • Nickel-Gold plated external power amplifiers
  • 5G mobile internet network

These materials are used extensively as heat sinks & pedestals for integrated circuits (I/C) as well as the supporting cases for I/C packaging. We offer these materials in cross-rolled sheet form for excellent x-y expansion properties as well as in pre-machined block form for I/C packaging.

Turnkey Solutions for Production Ready Pedestals

Our CMC and CPC products are processed as turnkey solutions for our customers in much the same way as our blended matrix products. We offer custom sizes through EDM and products delivered with Nadcap accredited plating and packaged in waffle packs.

  • Burr-free edges
  • Nadcap™ plating
  • Pick & place packaging


MOLYBDENUM-COPPER COMPOSITES (AMC SERIES)
COMPOSITIONS
AMC 6040 60% Molybdenum-40% Copper
AMC 6535 65% Molybdenum-35% Copper
AMC 7525 75% Molybdenum-25% Copper
AMC 8020 80% Molybdenum-20% Copper
AMC 8515 85% Molybdenum-15% Copper

DENSITY
g/cm3 lb./in.3
AMC 6040 9.68 0.349
AMC 6535 9.74 0.352
AMC 7525 9.87 0.356
AMC 8020 9.94 0.359
AMC 8515 10.01 0.361

THERMAL CONDUCTIVITY
W/mK BTU/hr.ft.°F
AMC 6040 215 125
AMC 6535 205 119
AMC 7525 185 108
AMC 8020 175 102
AMC 8515 165 96

THERMAL EXPANSION (in./in. x10 -6/°C)
30-150° C 30-400° C 30-800° C
AMC 6040 9.5 10.2 10.5
AMC 6535 9.0 9.4 9.8
AMC 7525 7.8 8.0 8.4
AMC 8020 7.2 7.5 7.9
AMC 8515 6.8 7.0 7.4

TUNGSTEN-COPPER COMPOSITES (AWC SERIES)
COMPOSITIONS
AWC 7525 75% Tungsten-25% Copper
AWC 8020 80% Tungsten-20% Copper
AWC 8515 85% Tungsten-15% Copper
AWC 8812 88% Tungsten-12% Copper
AWC 9010 90% Tungsten-10% Copper

DENSITY
g/cm3 lb./in.3
AWC 7525 14.98 0.541
AWC 8020 15.68 0.567
AWC 8515 16.45 0.594
AWC 8812 16.95 0.612
AWC 9010 17.3 0.625

THERMAL CONDUCTIVITY
W/mK BTU/hr.ft.°F
AWC 7525 186 107
AWC 8020 175 101
AWC 8515 162 93
AWC 8812 155 90
AWC 9010 150 86

THERMAL EXPANSION (in./in. x10 -6/°C)
30-150° C 30-400° C 30-800° C
AWC 7525 9.06 9.55 9.68
AWC 8020 8.21 8.60 8.63
AWC 8515 7.36 7.65 7.58
AWC 8812 6.78 7.00 6.86
AWC 9010 6.51 6.70 6.53