Tungsten-Copper Composites

Tungsten-copper composites (AWC) combine the special properties of tungsten and copper for exceptional performance. Tungsten’s extremely high melting point and low thermal expansion ensure stability at high temperatures, while copper adds superior thermal conductivity and ductility.

Together, they form tungsten-copper composites with unmatched properties for advanced thermal management applications.

Tungsten-Copper Advantages

Produced through wrought powder metallurgy, our tungsten-copper composites deliver significant advantages for thermal management.

High Temperature Resistance: With the highest melting point among all metals, tungsten ensures durability and stability at extreme temperatures.

Excellent Machinability: High ductility enables precise shaping and machining, allowing for the production of complex, high-precision parts.

Outstanding Thermal Conductivity: Copper’s conductivity provides efficient heat dissipation, making AWC suited for applications requiring effective thermal management.

Controlled Thermal Expansion: Customizable compositions allow us to control the coefficient of thermal expansion (CTE) for exacting requirements.

Tungsten-Copper Applications

Tungsten-copper (AMC) is used for a variety of semiconductor and electronic applications, such as:

• Electronic packages
• Chip mounting
• Heat sinks
• Circuit board cores
• Thermal spreaders

Tungsten-Copper Packaging

We provide a range of packaging services designed to protect, secure, and preserve the quality of our products.

• Waffle pack based on custom size of part
• Reel and tape packaging for production line efficiencies
• Glass Vial or custom solution