Heat Sinks and Heat Spreaders
We specialize in engineering high quality materials for heat sinks and heat spreaders in electronic packages, particularly Integrated Circuit (IC) packaging. These heat sink materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC).
Turnkey Solution for Production Ready Pedestals
Our advanced
thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging.
Sizes
Our heat spreader materials for IC packages are offered in a wide breadth of sizes including:
- Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm)
- Down to finished machined and plated products in 0.015” (0.381mm) cubes
Hermetic Housings and Heat Sinks
These thermal management products are used as both the hermetic housings and as the expansion-matched electronic heat sink and thermal spreaders for electronics.
Tight Thermal Expansion Control for IC Packages
We have the expertise to manufacture custom thermal management products for IC packages to allow for very specific rates of expansion and customized compositions for CTE Match.
The heat sink material can be matched to the CTE of specific semiconductors for the elimination of cracking due to uneven expansion at the interface of the semiconductor and the heat sink. Our processing ensures isotropic properties within the x-y plane while offering flexibility of thickness (z-direction) for the most efficient designs.
